Description
Boeing Intelligence & Analytics is seeking a Senior Microelectronics Test Engineer to join their team.
COVID-19:
As a U.S. government contractor, Boeing will require all new hires and employees located in the United States to be fully vaccinated against COVID-19 by December 8, 2021. Individuals who are unable to be fully vaccinated due to a disability/medical condition or sincerely held religious belief may apply for a reasonable accommodation during the post-offer process. Individuals who are approved for a reasonable accommodation will be subject to frequent COVID-19 testing and possibly other health and safety measures. Employees working in certain positions may be required to undergo frequent COVID-19 testing prior to December 8th if they are not fully vaccinated.
Location: This position can be based out of Huntington Beach, California; Huntsville, Alabama; Annapolis Junction, Maryland.
Position Responsibilities:
Test and characterization of integrated circuits
Working with digital, mixed signal, RF/microwave electronics
Working with Field Programmable Gate Arrays
Basic Qualifications (Required Skills and Experience)
Active TS/SCI clearance
Bachelor, Master or Doctorate of Science degree from an accredited course of study, in engineering, computer science, mathematics, physics or chemistry
3+ years of experience in the design and test of integrated circuits
Hands On experience utilizing high-performance microelectronics test equipment (prober, power supply, oscilloscope, spectrum analyzer, network analyzer, etc)
Preferred Qualifications (Desired Skills/Experience):
Experience analyzing and decomposing higher-level requirements to microelectronics-level requirements, interfaces, and test.
Experience developing test and verification plans and procedures.
Experience applying design-for-testability strategies and methods.
Experience supporting electronics testing, including designing test boards, writing test scripts (e.g. in LabView), writing test plans, and generating concise reports.
Experience with design and test of electronics for extreme temperature environments (e.g. cryogenic).
Experience with radiation effects on electronics including related testing (e.g. spacecraft electronics).
Experience extracting microelectronics performance parameters and building simulation models.
Experience supporting gate reviews (SRR, PDR, CDR, TRR) including generating and presenting material to upper management and other stakeholders.
Design experience in analog, digital, mixed signal, RF, or SoC domains or experience designing and/or testing chips in more than one domain or FPGA.
Experience working on large-scale SoC design teams.
Experience with architecture and design of packaged electronics (e.g. hybrid, module, system-in-package, heterogeneous, stacked).
Experience writing firmware or software for embedded systems.
Experience supporting military programs.
Demonstrated track record as a self-motived, independent, high-performance team member.
Excellent verbal and written communication ability.
Experience organizing and leading teams.
Typical Education/Experience: Education/experience typically acquired through advanced technical education from an accredited course of study in engineering, computer science, mathematics, physics or chemistry (e.g. Bachelor) and typically 14 or more years' related work experience or an equivalent combination of technical education and experience (e.g. PhD+9 years' related work experience, Master+12 years' related work experience). In the USA, ABET accreditation is the preferred, although not required, accreditation standard.
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